Span is experienced in designing and implementing a variety of test techniques to ensure products are reliable and thoroughly tested – saving customers’ time and money downstream by reducing field failures.
We develop sound test and inspection strategies that verify defined product quality and functionality, in addition to manufacturing process integrity.
PCBA can undergo full, high-resolution AOI inspection through our Mirtec MV-7Xi machines, with images retainable. All boards can be traceable by individual bar code. A rigorous first-off inspection process is performed on each build, complemented by a robust NPI procedure for new products.
BGA can undergo our Nicolet X-Ray imaging systems for inspection. This system is designed to provide affordable entry-level inspection capabilities for contract manufacturers, especially SMT boards using BGAs, flip chips, microBGAs and other high-density packages. This low-cost solution for failure analysis inspection and process verification provides critical information in real-time which is used to optimize yield, prevent waste, and verify manufacturing process tolerances for PC boards and components.
To further enhance our failure analysis capability and the ability to communicate with our customers on DFM and design robustness improvement, Span has in-house Olympus SZ Stereo Microscopes to enable image acquisition, quantitative measurements, reporting and advanced inspections tasks. Span’s stereo microscopes offer clear stereoscopic views with comfortable and ergonomic operation. Extensive types of frames with variety of optical options with wide range of zoom, support various applications. It delivers images with superb depth of field as well as clarity, detail and true-to-life color and built in ESD protection. Their dependable, high-performance optics are central to producing consistent accurate results. Our careful system selection of lens design allows the observation and documentation of specimens in their original, authentic colors without distortion.
Although relatively uncommon in small to medium volume manufacturing, Span offers on-site HP & GenRad in-circuit test, both analogue and digital, with vector-less test. For large volumes, ICT is invaluable as a pre-cursor to functional tests, reducing debug time and significantly increasing functional test yield.
By using functional testing, our customers not only verify board functionality, but also, provide confirmation that the PCB will perform in its application environment.
End-users count on your products to be safe and reliable. Span’s Cincinnati Sub-Zero (CSZ) environmental test chamber can aid reliability testing by subjecting products to real-world climate and wear extremes like temperature, humidity and more. Temperatures range from -45 degC to +190 degC and humidity ranges from 10% to 98% RH. Span’s 8 cu. Ft. (227L) environmental test chamber may be used for basic thermal cycling to accelerated stress testing, by either static or dynamics testing. Our customers always benefit from this reliability testing service to make their products more robust in terms of design and process, and as a more economical solution having a positive test result before confidently finally testing their products at accredited testing facilities for any required product certification.
SPAN Manufacturing Inc
