Span is experienced in designing and implementing a variety of test techniques to ensure products are reliable and thoroughly tested – saving customers’ time and money downstream by reducing field failures.
We develop sound test and inspection strategies that verify defined product quality and functionality, in addition to manufacturing process integrity.
PCBA can undergo full, high-resolution AOI inspection through our Mirtec MV-7Xi machines, with images retainable. All boards can be traceable by individual bar code. A rigorous first-off inspection process is performed on each build, complemented by a robust NPI procedure for new products.
BGA can undergo our Nicolet X-Ray imaging systems for inspection. This system is designed to provide affordable entry-level inspection capabilities for contract manufacturers, especially SMT boards using BGAs, flip chips, microBGAs and other high-density packages. This low-cost solution for failure analysis inspection and process verification provides critical information in real-time which is used to optimize yield, prevent waste, and verify manufacturing process tolerances for PC boards and components.